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Power chips are connected to external circuits via packaging, and their efficiency depends on the support of the packaging. In high-power scenarios, power chips are typically packaged as power components. Chip interconnection refers to the electrical link on the top surface of the chip, which is typically aluminum bonding cord in typical modules. ^ Typical power component plan cross-section
Presently, commercial silicon carbide power components still mainly make use of the packaging innovation of this wire-bonded traditional silicon IGBT module. They encounter troubles such as big high-frequency parasitical criteria, not enough warm dissipation capacity, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of superb efficiency. In order to solve these troubles and fully make use of the huge potential benefits of silicon carbide chips, lots of new packaging technologies and services for silicon carbide power components have arised in recent years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold cords to copper wires, and the driving force is expense decrease; high-power devices have established from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The better the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared to typical bonding packaging methods, Cu Clip technology has the following benefits:
1. The connection in between the chip and the pins is made from copper sheets, which, to a specific extent, changes the typical cable bonding technique in between the chip and the pins. As a result, an one-of-a-kind package resistance worth, higher existing flow, and far better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can completely save the cost of silver plating and inadequate silver plating.
3. The product look is completely constant with typical items and is mostly made use of in web servers, portable computer systems, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is extra expensive and complicated, yet it can accomplish far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The source pad makes use of a Clip method, and eviction uses a Cord method. This bonding technique is somewhat less expensive than the all-copper bonding approach, saving wafer location (suitable to extremely tiny entrance locations). The procedure is easier than the all-copper bonding method and can acquire better Rdson and far better thermal impact.
Provider of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper sheet, please feel free to contact us and send an inquiry.
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